54150-0878
Verfügbare Menge
2 454
Versand möglich
fertig zum Versand
Standort
AT
Marke
Molex
Mpn
54150-0878
Datenblatt
Beschreibung
Conn Board to Board RCP 80 POS 0.5mm Solder ST SMD SlimStack™ T/R
Technische Daten: 54150-0878
China RoHS
Compliant
Lead Free
Lead Free
Radiation Hardening
No
REACH SVHC
Unaffected
RoHS
Compliant
Lead Pitch
500 µm
Pitch
508 µm
Row Spacing
4.5974 mm
Stack Height
2.5 mm
Terminal Pitch
500 µm
Contact Material
Bronze
Contact Plating
Gold
Housing Material
Thermoplastic
Insulation Color
Black
Mount
Surface Mount
Plating
Gold
Country of Origin
JP
Export Control Classification Number (ECCN) Code
EAR99
Harmonized Tariff Schedule (HTS) Code
8536.69.40.40
Introduction Date
2004-12-15
Lifecycle Status
Obsolete (Last Updated: 6 years ago)
LTB Date
2019-11-28
LTD Date
2020-02-28
Manufacturer Lifecycle Status
OBSOLETE (Last Updated: 6 years ago)
Contact Resistance
40 mΩ
Current Rating
500 mA
Gender
Female
Insulation Resistance
100 MΩ
Max Operating Temperature
85 °C
Max Voltage Rating (AC)
50 V
Min Operating Temperature
-40 °C
Number of Circuits
80
Number of Contacts
80
Number of Positions
80
Number of Rows
2
Orientation
Vertical
Plating Thickness
254 nm
Termination
SMD/SMT
Voltage Rating
50 V
Voltage Rating (DC)
50 V
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